Microelectronic Materials Characterization: an Update

In a previous article, I various microelectronic materials analysis and characterization tools and techniques were presented with a focus on ensuring the quality of APL'S microelectronic products. Those tools and techniques can also be applied to the development of new materials and products for current and future microelectronics applications. This article discusses the development, characterization, and application of materials for two evolving microelectronics application areas: highdensity substrate interconnections produced by complex, high-speed integrated circuits; and the thermal management of high-power-dissipating integrated circuits. The fIrst area involves the creation of high-speed, controlledimpedance, high-density-substrate interconnections using multilayer thin-film hybrid structures with an organic interlayer dielectric. For the second, the thermal dissipation requirements of today's high-performance integrated circuits will be handled by building both thickand thinfilm structures on aluminum nitride (AIN) substrates.